Title:
PRODUCTION OF IC LEAD FRAME
Document Type and Number:
Japanese Patent JPH05175387
Kind Code:
A
Abstract:
PURPOSE: To permit an inner lead to be cut from an island keeping the highly accurate relative positions in the process of manufacturing an IC lead frame.
CONSTITUTION: Tape 4 is adhered over an inner lead 1 and an island supporting part 2 before cutting an inner lead 1 from an island 5 and the relative positions are fixed to be cut along a cutting line 7.
Inventors:
YAMAMOTO MASUZO
Application Number:
JP2719291A
Publication Date:
July 13, 1993
Filing Date:
February 21, 1991
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H01L23/50; (IPC1-7): H01L23/50