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Patent Searching and Data


Title:
PRODUCTION OF LEAD PIN WITH SILVER SOLDER
Document Type and Number:
Japanese Patent JP02207965
Kind Code:
A
Abstract:

PURPOSE: To simplify the process for production and to shorten the time for production by subjecting the joining and winding of a silver solder wire rod to a stock wire to spot welding only at one point and pressing the same by means of molding jigs.

CONSTITUTION: The silver solder wire rod 2 which comes into contact at one point with the stock wire 1 subjected to a linearization treatment and is subjected to a linearization treatment in the direction orthogonal with the stock wire 1 is supplied by a specified length to the stock wire 1 and the contact point is spot welded M. The silver solder wire rod 2 is pressed on a semi- cylindrical surface 5 from the side of the welded point M by a reforming jig 4 having the semi-cylindrical surface 5 of the radius larger than the length adding the diameter of the silver solder wire rod 2 to the radius of the stock wire 1 and is thereby curved along the surface 5 and is reformed. Both ends of the silver solder wire rod 2 are then crimped and pressed by a pair of the molding jigs 6 from the direction orthogonal with the pressing direction of the jig 4, by which the wire rod 2 is wound on the stock wire 1. The stock wire 1 is then cut to a specified length to end the process for production.


Inventors:
Shibata, Masashi
Application Number:
JP1989000028258
Publication Date:
August 17, 1990
Filing Date:
February 06, 1989
Export Citation:
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Assignee:
TSURITANI DOUNIYUUSEN KOGYO KK
International Classes:
B21G3/00; B23K1/00; B21G3/00; B23K1/00; (IPC1-7): B21G3/00; B23K1/00