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Patent Searching and Data


Title:
PRODUCTION OF METALLIC WIRING FOR ACTIVE MATRIX LCD
Document Type and Number:
Japanese Patent JPH05107553
Kind Code:
A
Abstract:

PURPOSE: To provide a process for producing metallic wirings of an active matrix LCD capable of improving the step coverage of the laminated films to be formed in subsequent stages, adjusting the thicknesses of the metallic wirings without increasing the difference in levels, decreasing the resistance of the metallic wirings and improving the reliability and stability thereof by removing the difference in level between a glass substrate and the metallic wirings.

CONSTITUTION: Photoresist patterns 13 are formed on the upper part of the glass substrate 11 and the exposed parts of the glass substrate 11 are removed by as much as the thickness of the metallic wirings. A metallic film 15 is formed over the entire surface of the structure and is then the metallic film 15 of the parts excluding the metallic wirings is removed by an ordinary lift-off stage, by which the metallic wirings are formed on the glass substrate 11.


Inventors:
BEE BIYUNNSON
BEE YONNGUGU
KIMU NAMUUDOGU
Application Number:
JP7054492A
Publication Date:
April 30, 1993
Filing Date:
March 27, 1992
Export Citation:
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Assignee:
SAMSUNG ELECTRONIC
International Classes:
G02F1/1345; (IPC1-7): G02F1/1345
Domestic Patent References:
JPS63235983A1988-09-30
JPH04170519A1992-06-18
Attorney, Agent or Firm:
Hidekazu Miyoshi