PURPOSE: To obtain a metallized film having improved adhesive strength to a base material film irregardless of the kind of resin and further electric conductivity, by heat-treating a film obtained from a polymer containing an organomemallic complex.
CONSTITUTION: A solution of a polymeric composition containing an organometallic complex, preferably soluble in organic solvents, liberating a metal by heating, and expressed by the formula MmLn (M is a metal or Group IVA, VA, VIA, VIIA or I B, etc. in the periodic table; L is tertiary phosphine, carbon monoxide or conjugated olefin, etc.; m is an integer 1W4; n is an integer 2W12), e.g. polysulfone, is cast on a casting substrate, e.g. steel, and heat-treated preferably at 100W350°C to give the aimed metallic film having the only selectively metallized surface in contact with a metallizing substrate, e.g. copper or aluminum.
USE: Heating sheets, base boards for circuits and electromagnetic wave shielding plates.
KONDOU SEI
NOGAMI TATSUYA
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