Title:
PRODUCTION METHOD FOR CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2003101192
Kind Code:
A
Abstract:
To form the circuit pattern of especially high position accuracy and highly refined on a flexible film which is liable to cause a change in dimension by the influence of heat, humidity or external force.
In this production method for circuit board, a flexible film is stuck with a reinforcing plate through a releasable organic layer. After the circuit pattern of especially high definition is formed on the flexible film by semi-additive or full additive method, the flexible film is released from the reinforcing plate.
Inventors:
AKAMATSU TAKAYOSHI
KOKUNI MASAHIRO
OKUYAMA FUTOSHI
KOKUNI MASAHIRO
OKUYAMA FUTOSHI
Application Number:
JP2001288402A
Publication Date:
April 04, 2003
Filing Date:
September 21, 2001
Export Citation:
Assignee:
TORAY INDUSTRIES
International Classes:
C23C18/16; C25D7/00; H05K3/10; (IPC1-7): H05K3/10; C23C18/16; C25D7/00
Previous Patent: CIRCUIT BOARD AND PRODUCTION METHOD THEREFOR
Next Patent: PRODUCTION METHOD FOR CIRCUIT BOARD
Next Patent: PRODUCTION METHOD FOR CIRCUIT BOARD