To provide a production method for surface acoustic wave(SAW) device by which an electrode or resist is hardly damaged by heating in an electrode forming process and a piezoelectric substrate is hardly cracked in flip chip bonding, etc., without increasing a production process.

When producing a SAW device in which first and second SAW elements having different electrode thickness are constituted on a piezoelectric substrate 1, an IDT electrode 2 of the first SAW element, electrode pad layers 8a and 9a, electrode pad layers 10a and 11a of the second SAW element and wiring 16 for short-circuiting are simultaneously formed and when forming an IDT electrode 3 of the second SAW element, the electrode pad layers 8a, 9a, 10a and 11a are made into two layers and after electrodes are completely formed, wiring 16 and 17 for short-circuiting are disconnected.