Title:
PRODUCTION OF MODIFIED POLYAMIDE RESIN, MODIFIED POLYAMIDE OBTAINED THEREBY AND ADHESIVE AND FILM CONTAINING THE RESIN
Document Type and Number:
Japanese Patent JP3656771
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a process for producing a modified polyamide resin excellent in adhesiveness and also excellent in chemical resistance, heat resistance, processability, etc., to provide a modified polyamide resin obtained thereby and to provide adhesives and films containing the resin.
SOLUTION: This process for producing a modified polyamide resin comprises reacting a phenolic compound with am amideepoxy resin obtained by reacting acid-terminated polyamide resin obtained by reacting an acid component consisting essentially of a dicarboxylic acid being a reaction product of a polyalkylene glycol or a polycarbonate diol with a dicarboxylic acid compound with a diisocyanate in a molar ratio, carboxyl groups/isocyanate groups, of larger than 1 in a molar ratio, epoxy groups/carboxyl groups, of equal to or larger than 1. A modified polyamide resin obtained thereby, and adhesives and films containing the modified polyamide resin as the principal component are also provided.
Inventors:
Takao Hirayama
Yoshiyuki Mukaiyama
Toshihiko Ito
Hiroaki Hirakura
Ken Nanami
Kiyoshi Hirosawa
Yoshiyuki Mukaiyama
Toshihiko Ito
Hiroaki Hirakura
Ken Nanami
Kiyoshi Hirosawa
Application Number:
JP31017895A
Publication Date:
June 08, 2005
Filing Date:
November 29, 1995
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C08G69/48; C08G18/42; C08G59/14; C08G59/20; C08G59/42; C08G59/60; C08G59/62; C08L63/00; (IPC1-7): C08G59/14; C08G59/20; C08G59/42; C08G69/48
Domestic Patent References:
| JP8193119A | ||||
| JP5295081A | ||||
| JP5051571A | ||||
| JP5051447A | ||||
| JP2022319A |
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