Title:
PRODUCTION OF MULTILAYER CERAMIC WIRING BOARD
Document Type and Number:
Japanese Patent JP2581436
Kind Code:
B2
Abstract:
PURPOSE: To suppress connection trouble of through holes by preventing deformation of a green sheet.
CONSTITUTION: A green sheet 1 is formed on a carrier film and a through hole is made through the green sheet 1 using the carrier film as a mask. The green sheet 1 is then applied to a thick plate 4 and sequentially bonded and laminated thus forming a ceramic green sheet laminate. It is then fired to complete a multilayer ceramic wiring board.
Inventors:
INASAKA JUN
Application Number:
JP35238093A
Publication Date:
February 12, 1997
Filing Date:
December 29, 1993
Export Citation:
Assignee:
NIPPON ELECTRIC CO
International Classes:
H05K3/46; B32B18/00; H01L21/48; H01L21/68; H05K3/40; H05K1/03; (IPC1-7): H05K3/46
Domestic Patent References:
| JP5299840A | ||||
| JP3148196A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)