PURPOSE: To throw a printing pattern layer laminating process and a hot melt resin film laminating process into one process by a method wherein a printing pattern layer and an adhesive layer are provided to the single surface of a multilayered resin film formed by the co-extrusion of resin films in such a state that a release resin layer is interposed between the resin films to be taken up to be bonded to the film under pressure and one of the resin films is released from the release resin layer in such a state that the printing pattern layer is interposed between the films.

CONSTITUTION: Multilayered resin films 10, 11, 12 wherein a release resin layer 10 having a printing pattern layer 21 and an adhesive layer 22 provided to the surface thereof is interposed are taken up to be bonded. The outermost resin film 11 of the taken-up multilayered resin films 10, 11, 12 is released from the release resin layer 10 and cut by one round quantity of taking-up to be removed. That is, by interposing the release resin layer between the multilayered resin films molded by co-extrusion, the release of the multilayered resin films becomes possible and a conventional process releasing the outermost resin film of the taken-up multilayered resin films from the release resin layer to laminate a hot-melt resin film is not required.