To provide a method to easily produce and passivate an org. LED matrix with high accuracy.

A photoresist layer 14 is formed on a substrate 13, then a metal layer 15 is formed on the photoresist layer, and material units 30, 32, 34 are patterned on the substrate 13. First, the photoresist layer 14 is patterned to regulate an aperture 20 which exposes a part of the substrate 13, and then the metal layer 15 is patterned to form a hole 19 which is smaller than the aperture. Thus, the exposed surface of the substrate 13 is divided into a dark region 22, 23 and a bright region 21. A first material system 31 is vapor deposited almost perpendicular to the hole 19 to form a first org. LED 30 on the substrate surface in the bright region 21. Second and third material systems 33, 35 are vapor deposited with certain angles α, β to the hole 19 to form second and third org. LEDs 32, 33 in the dark region 22, 23. Then a passivation material 70, 72, 74 is vapor deposited perpendicular on the first LED and with certain angles α, β on the second and third LEDs.