Title:
PRODUCTION OF POLYAMIDE-BASED RESIN, POLYAMIDE-BASED RESIN AND POLYAMIDE-BASED RESIN FILM OBTAINED BY ITS PRODUCTION
Document Type and Number:
Japanese Patent JPH0733856
Kind Code:
A
Abstract:
PURPOSE: To provide production of a polyamide-based resin having high molecular weight, supplying a film having excellent heat resistance and flexibility and a composition directly usable as a coating compound and an adhesive and to obtain a polyamide-based resin and a polyamide-based resin film by the production.
CONSTITUTION: A diisocyanate (A) is reacted with a dicarboxylic acid and/or a tricarboxylic acid anhydride (B) in a nitrogen-containing aprotic solvent to give an intermediate for a polyamide-based resin, which is reacted with an epoxy resin (C) to provide production of a polyamide-based resin. A polyamide- based resin and a polyamide-based resin film are obtained by the production.
Inventors:
SUZUKI KENJI
MUKOYAMA YOSHIYUKI
ITO TOSHIHIKO
MUKOYAMA YOSHIYUKI
ITO TOSHIHIKO
Application Number:
JP17895493A
Publication Date:
February 03, 1995
Filing Date:
July 20, 1993
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08G18/76; C08G18/83; C08G59/40; C08G59/44; C08G59/54; C08G18/34; C08G69/44; C08G69/48; C08G73/10; C08J5/18; C08L63/00; (IPC1-7): C08G59/44; C08G18/34; C08G59/40; C08J5/18
Attorney, Agent or Firm:
Kunihiko Wakabayashi
Next Patent: FLUID EPOXY RESIN COMPOSITION