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Title:
PRODUCTION OF POLYOLEFIN RESIN MOLDING
Document Type and Number:
Japanese Patent JPS58145745
Kind Code:
A
Abstract:

PURPOSE: To obtain a polyolefin resin molding having an improved surface, by mixing a polyolefin resin with a compsn. consisting of a polyolefin and an org. or inorg. filler without kneading, and injection-molding the mixture.

CONSTITUTION: 5W50pts.wt. polyolefin resin is mixed with 100pts.wt. compsn. consisting of a polyolefin resin and an org. and/or inorg. filler without kneading. The mixture is injection-molded. Examples of the polyolefin resins are those having an MW of pref. 50,000W300,000. Low-density to high-density ethylene homopolymer, propylene homopolymer, copolymers of ethylene with propylene and copolymers of ethylene or propylene with other α-olefin are preferred. When the amount of the polyolefin resin is less than 5pts.wt. no improved effect can be obtd., while when it exceeds 50pts.wt., the ratio of the filler is greatly reduced, and physical characteristics is changed, and hence, the expected purpose can not be achieved.


Inventors:
TAKAHASHI TSUYOSHI
TAKEMURA KENJI
NAGAOKA TAKESHI
Application Number:
JP2729582A
Publication Date:
August 30, 1983
Filing Date:
February 24, 1982
Export Citation:
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Assignee:
SHOWA DENKO KK
International Classes:
C08L23/26; B29C35/00; B29C45/00; C08J3/20; C08K3/00; C08K5/00; C08L7/00; C08L21/00; C08L23/00; C08L23/02; C08L33/00; C08L33/02; C08L51/00; C08L51/02; C08L67/00; C08L77/00; C08L101/00; (IPC1-7): B29F1/00; C08J3/20; C08K3/00; C08K5/00; C08L23/02; C08L23/26
Attorney, Agent or Firm:
Kikuchi Seiichi



 
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