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Title:
PRODUCTION OF PREPREG FOR PRINTED CIRCUIT BOARD
Document Type and Number:
Japanese Patent JPS61272245
Kind Code:
A
Abstract:

PURPOSE: To obtain the titled prepreg having improved drillability, etc., by using a varnish obtained by compounding a silicone-modified epoxy resin with a polyfunctional phenol, a cure accelerator, a fluororesin or a polyolefin and a guanidine derivative.

CONSTITUTION: The objective prepreg can be produced by compounding (A) 100pts.(wt.) of an epoxy resin containing 1W100wt% silicone-modified epoxy resin produced by reacting (i) a bisphenol-A epoxy resin, (ii) tetrabromobisphenol A and (iii) a methoxy-containing silicone intermediate, e.g. the compound of formula (R is methyl, phenyl or methoxy; n is 0W3), with (B) a polyfunctional phenol, (C) 0.05W1pt. of a cure accelerator, preferably an imidazole compound having masked imino group, (D) 0.1W100pts. of a fluororesin or a polyolefin and (E) 0.1W1pt. of a guanidine derivative and impregnating and drying the resultant varnish in a substrate.


Inventors:
YUSA MASAMI
SHIBATA KATSUJI
MIYADERA YASUO
Application Number:
JP11493385A
Publication Date:
December 02, 1986
Filing Date:
May 28, 1985
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08G59/00; C08G59/14; C08G59/50; C08G59/62; C08J5/24; C08L1/00; C08L7/00; C08L21/00; C08L23/00; C08L27/00; C08L63/02; C08L101/00; H05K1/03; (IPC1-7): C08G59/14; C08G59/50; C08G59/62; C08J5/24; C08L63/02
Attorney, Agent or Firm:
Kunihiko Wakabayashi



 
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