Title:
PRODUCTION PROCESS FOR CEMENTED WOOD BOARD
Document Type and Number:
Japanese Patent JP2002187759
Kind Code:
A
Abstract:
To provide a production process for a cemented wood board which has excellent adhesion to a coating film and remarkably improved dimensional stability and, in which no microcrack is caused, even when the board contains mica.
This production process comprises preparing a raw material mixture that consists essentially of a wood reinforcing material and a cement- based inorganic material and also contains powdery mica which has a ≥150 μm average particle size and has an aspect ratio (length/thickness) of ≥65, spraying the raw material mixture on a plate to form a mat, and clamping the mat and subjecting the clamped mat to autoclave curing at ≥60°C, in the presence of water.
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Inventors:
KAWAI HIDENORI
Application Number:
JP2000388658A
Publication Date:
July 05, 2002
Filing Date:
December 21, 2000
Export Citation:
Assignee:
NICHIHA KK
International Classes:
B32B13/10; C04B14/20; C04B28/02; C04B40/02; C04B41/62; C04B41/65; C04B111/20; (IPC1-7): C04B28/02; B32B13/10; C04B14/20; C04B40/02
Domestic Patent References:
JPH09227252A | 1997-09-02 | |||
JPH09255394A | 1997-09-30 | |||
JPH06172009A | 1994-06-21 | |||
JPH07215744A | 1995-08-15 | |||
JPH0867547A | 1996-03-12 | |||
JPH10231161A | 1998-09-02 | |||
JP2000016848A | 2000-01-18 | |||
JPH082957A | 1996-01-09 | |||
JPH09156987A | 1997-06-17 |
Attorney, Agent or Firm:
Tadao Usami
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