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Title:
PRODUCTION PROCESS FOR CEMENTED WOOD BOARD
Document Type and Number:
Japanese Patent JP2002187759
Kind Code:
A
Abstract:

To provide a production process for a cemented wood board which has excellent adhesion to a coating film and remarkably improved dimensional stability and, in which no microcrack is caused, even when the board contains mica.

This production process comprises preparing a raw material mixture that consists essentially of a wood reinforcing material and a cement- based inorganic material and also contains powdery mica which has a ≥150 μm average particle size and has an aspect ratio (length/thickness) of ≥65, spraying the raw material mixture on a plate to form a mat, and clamping the mat and subjecting the clamped mat to autoclave curing at ≥60°C, in the presence of water.


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Inventors:
KAWAI HIDENORI
Application Number:
JP2000388658A
Publication Date:
July 05, 2002
Filing Date:
December 21, 2000
Export Citation:
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Assignee:
NICHIHA KK
International Classes:
B32B13/10; C04B14/20; C04B28/02; C04B40/02; C04B41/62; C04B41/65; C04B111/20; (IPC1-7): C04B28/02; B32B13/10; C04B14/20; C04B40/02
Domestic Patent References:
JPH09227252A1997-09-02
JPH09255394A1997-09-30
JPH06172009A1994-06-21
JPH07215744A1995-08-15
JPH0867547A1996-03-12
JPH10231161A1998-09-02
JP2000016848A2000-01-18
JPH082957A1996-01-09
JPH09156987A1997-06-17
Attorney, Agent or Firm:
Tadao Usami