To provide a production process of a conductive resin molding equipped with conduction terminals, which can form conduction terminals of sufficient adhesion and conductivity on the surface of the conductive resin molding without spoiling appearance quality.
Wiring patterns 3-5 are integrally molded by dual component molding inside an insulating body 2 using a synthetic resin in which nickel is blended in dispersion as a conductive filler, nickel thin coats are formed by direct vapor deposition on end faces of wiring exposed from an end surface 2a of the body 2, and the obtained products are used as conductive terminals 6-8. A conductive component 1 equipped with conductive terminals of secured adhesion and conductivity is achieved without spoiling appearance quality.
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