Title:
PRODUCTION OF RESIN AND RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP3292616
Kind Code:
B2
Abstract:
PURPOSE: To obtain a phenolic resin or an epoxy resin available for a laminated sheet material, a solder resist material or a photo-setting material.
CONSTITUTION: The phenolic resin is produced by adding a phenol, in the presence of an acid catalyst, to an olefinic mixture comprising from 10-90wt.% of 4-5C conjugated diene polymer and 90-10wt.% of 4-15C diene hydrocarbon; the epoxy resin is obtained by reacting an epihalohydrin to this phenolic resin; several compositions comprise this phenolic resin and/or this epoxy resin. The cured products from these composition are excellent in electric properties such as dielectric constants and dielectric dissipation factors, heat resistance, adhesive power and moisture absorption resistance.
Inventors:
Hiroshi Ohtsuki
Hitoshi Yuasa
Bunmei Oshimi
Masami Enomoto
Hitoshi Yuasa
Bunmei Oshimi
Masami Enomoto
Application Number:
JP2066695A
Publication Date:
June 17, 2002
Filing Date:
February 08, 1995
Export Citation:
Assignee:
Nisseki Mitsubishi Corporation
International Classes:
G03F7/027; B32B27/38; C08G59/00; C08G59/06; C08G59/14; C08G59/18; C08G61/00; C08G61/02; C08K5/00; C08L63/00; C08L65/00; G03F7/028; G03F7/038; H01L23/29; H01L23/31; H05K3/18; H05K3/28; (IPC1-7): C08G61/02; B32B27/38; C08L63/00; C08L65/00
Domestic Patent References:
| JP5061493A |
Attorney, Agent or Firm:
Hajime Sakai