PRODUCTION OF ROOM-TEMPERATURE-CURING ORGANOPOLYSILOXANE COMPOSITION

Japanese Patent JP3712029

B2

PROBLEM TO BE SOLVED: To provide a process for producing a room-temperature-curing organopolysiloxane composition which can be used as a one-component RTV composition markedly improved in sagging resistance without the aid of an antisagging agent and is very excellent in workability in delivery, slump properties, etc., when used as a sealing material such as one for building.
SOLUTION: There is provided process for producing a room-temperature- curing organopolysiloxane composition containing (A) 100 pts.wt. organopolysiloxane having at least two SiOH groups or hydrolyzable groups in the molecule and having a viscosity (25°C) of 100 cSt; (B) 1-20 pts.wt. organosilane having at least two hydrolyzable groups in the molecule or a partial hydrolyzate thereof; and (C) 2-200 pts.wt. inorganic filler, which process comprises previously mixing A with B under the exclusion of moisture; and adding C to the resultant mixture.

JP3338330	COMPOSITE MOLDED ITEM OF POLYESTER RESIN
JP2005272739	EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
JP3415292	EPOXY RESIN COMPOSITION FOR SEALING OF SEMICONDUCTOR

Masatoshi Miyake
Suzuki and his group
Teshigawara Mamoru
Tsuneo Kimura

JP3214598A

November 02, 2005

January 29, 1998

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Shin-Etsu Chemical Co., Ltd.

C08K3/00; C08G77/04; C08G77/14; C08K3/26; C08K3/34; C08K5/5415; C08K5/5419; C08L83/04; C08L83/06; C08L83/14; (IPC1-7): C08L83/06; C08K3/00; C08K3/26; C08K3/34; C08K5/5415

JP2041361A
JP2133492A
JP5105813A
JP6234148A
JP7097518A
JP62135560A
JP61021158A
JP57202345A
JP56000853A
JP2011659A
JP55147552A
JP60158254A
JP3210366A
JP3041157A
JP4366171A
JP2133491A
JP8269334A
JP8269335A

Takashi Kojima
Yuko Nishikawa

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