PRODUCTION OF SEMICONDUCTOR DEVICE, AND CARRIER TAPE AND SEMICONDUCTOR PRODUCTION DEVICE USED THEREIN

Title:

PRODUCTION OF SEMICONDUCTOR DEVICE, AND CARRIER TAPE AND SEMICONDUCTOR PRODUCTION DEVICE USED THEREIN

Document Type and Number:

Japanese Patent JP2000025709

Kind Code:

A

Abstract:

To prevent a carrier tape from breaking during sealing with a resin, by omitting chip bonding, wire bonding, and molding in set areas including joints.

In the joint parts 39 of carrier tape 1, joint marks 6 are provided. After the detection of the marks, the carrier tape is skipped without carrying out chip bonding, wire bonding, and molding in set skip-areas, therefore heat is not applied to the joint parts, the carrier tape is prevented from breaking due to peel and separation of the joined tape, and an operation is continuously carried out. Because the joint parts 39 are not molded, failure in sealing with a resin does not occur and an IC module whose quality is stable can be produced. Also when failure marks are detected during a wire-bonding process, the carrier tape can be skipped.

More Like This:

WO/2002/054848	METHOD AND APPARATUS FOR REMOVAL OF ELECTRONIC COMPONENTS FROM CARRIER TAPE
JPS5972796	[Title of the device] Taping Parts chain of A tip-like electronic parts

Inventors:

TAKEI EIJI

Application Number:

JP19691998A

Publication Date:

January 25, 2000

Filing Date:

July 13, 1998

Export Citation:

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Assignee:

HITACHI LTD

International Classes:

B65D73/02; B65B15/04; H01L21/60; (IPC1-7): B65B15/04; B65D73/02; H01L21/60

Attorney, Agent or Firm:

Akita Aki

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