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Title:
PRODUCTION OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS5261980
Kind Code:
A
Abstract:
PURPOSE:To obtain satisfactory multilayer wirings and increase the scale of integration of an IC by forming a first wiring layer on the surface of a semiconductor substrate, covering the entire surface with an insulating film of the same thickness, removing the raised portions thereof to flatten insulating film, then again depositing an insualting film over the entire surface and laminating and forming a second wiring layer thereon.

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Inventors:
KOTANI SHIGEO
AOYAMA MASAHARU
Application Number:
JP13845775A
Publication Date:
May 21, 1977
Filing Date:
November 18, 1975
Export Citation:
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Assignee:
TOKYO SHIBAURA ELECTRIC CO
International Classes:
H05K3/46; H01L21/3205; H05K3/00; (IPC1-7): H01L21/88; H05K3/00



 
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