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Title:
PRODUCTION OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS5299074
Kind Code:
A
Abstract:
PURPOSE:Ingress of resist agents is eliminated and etching time is reduced by removing the desired parts of the resist films formed on the entire surface of a semiconductor wafer by laser beam or dicing device thus forming groove holes and eliminating the need for masks and mask alignment.

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Inventors:
KACHI MASAO
ASAMI HIROSHI
Application Number:
JP1635076A
Publication Date:
August 19, 1977
Filing Date:
February 16, 1976
Export Citation:
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Assignee:
NIPPON ELECTRIC CO
International Classes:
H01L29/74; H01L21/027; H01L21/302; H01L21/306; H01L21/331; H01L29/73; (IPC1-7): H01L21/302
Domestic Patent References:
JP32001485A
JPS5218175A1977-02-10



 
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