Title:
PRODUCTION OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS5358765
Kind Code:
A
Abstract:
PURPOSE:To perform adjustment of solder amount by bonding a heat sink to the thick film conductor part within a thick film insulation frame body through the use of Sn-Pb base solder.
Inventors:
KOBAYASHI EIJI
Application Number:
JP13349276A
Publication Date:
May 26, 1978
Filing Date:
November 06, 1976
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L21/52; H01L21/58; (IPC1-7): H01L21/58