Title:
PRODUCTION OF SPUTTERING TARGET
Document Type and Number:
Japanese Patent JPH0726375
Kind Code:
A
Abstract:
PURPOSE: To enhance the bonding strength of a sputtering target material to a backing plate and to prevent the peeling of the target material.
CONSTITUTION: One side of a sputtering target material 11 is polished to form a bonding face 12 having no ruggedness, the target material 11 is heated and a bonding material 13 is melted and applied to the bonding face 12. A heated backing plate 14 is then bonded to the bonding face 12 through the bonding material 13.
Inventors:
KURISU KENICHI
Application Number:
JP19416493A
Publication Date:
January 27, 1995
Filing Date:
July 08, 1993
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
C23C14/34; (IPC1-7): C23C14/34
Attorney, Agent or Firm:
Akira Wada