Title:
SHIELD DEVICE
Document Type and Number:
Japanese Patent JP3228841
Kind Code:
B2
Abstract:
PURPOSE: To provide a compact shield device capable of obtaining a specific shield which dispenses with a shield case.
CONSTITUTION: An LSI chip pattern 2 is formed on a BGA ceramic substrate 1 and a shield plate 5 is provided on the LSI chip pattern 2. Next, through holes 3 are formed on the peripheral part of the BGA ceramic substrate 1 so as to provide solder balls 6 beneath the through holes 3. Next, the BGA ceramic substrate 1 is packaged on a multilayer substrate 7 while an earth foil encircling the BGA ceramic substrate 1 is formed on an outer layer 8 of the multilayer substrate 7.
Inventors:
Mannori Yamate
Akio Nakatani
Akio Nakatani
Application Number:
JP26081394A
Publication Date:
November 12, 2001
Filing Date:
October 26, 1994
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H05K9/00; H05K1/02; H05K3/34; (IPC1-7): H05K9/00
Domestic Patent References:
| JP6204681A | ||||
| JP6386600A | ||||
| JP514015A | ||||
| JP6268407A | ||||
| JP6275463A | ||||
| JP479352A | ||||
| JP652191U |
Attorney, Agent or Firm:
Yoshihiro Morimoto