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Patent Searching and Data


Title:
PRODUCTION OF THERMOSETTING RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPS6392624
Kind Code:
A
Abstract:

PURPOSE: To obtain the title easily moldable composition which can give a three-dimensional cured product of a low dielectric constant and excellent heat resistance, by prereacting 1,5,9-cyclododecatriene with a specified polymaleimide in an inert solvent.

CONSTITUTION: 10W30wt% 1,5,9-cyclododecatriene (A) which is a nonconjugated cyclotriene obtained by cyclopolymerizing three 1,3-butadiene molecules is prereacted with 90W70wt% polymaleimide (B) of the formula (wherein R1 is an n-valent 2C or higher organic group and a is 2W10), e.g., N,N'-p,p'- diphenylmethanebismaleimide, at 100W200°C in an inert solvent (C) (e.g., cyclohexane) in an amount to give a resin content ≤70wt% to the obtained varnish to obtain the title composition which is a varnish which, even when cooled to room temperature, does not cause phase separation and can be kept in a uniform state. If necessary, an organic peroxide as a radical reaction initiator may be added to this composition.


Inventors:
HIROZAWA KIYOSHI
MIYADERA YASUO
FUJIOKA ATSUSHI
Application Number:
JP23864686A
Publication Date:
April 23, 1988
Filing Date:
October 07, 1986
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08F220/40; C08F20/52; C08F32/00; C08F232/06; (IPC1-7): C08F220/40; C08F232/06
Attorney, Agent or Firm:
Hirose Akira