Title:
PRODUCTION OF WAFER HOLDING CONVEYER
Document Type and Number:
Japanese Patent JPH11165353
Kind Code:
A
Abstract:
To provide a method for producing a plastic wafer holding conveyer capable of obtaining a bonded part excellent in reliability and economical efficiency.
The end surfaces of rod-shaped members a1-a3 mounted on a lower fixing jig N among three rod-shaped members a1-a3 and end plate members b1-b2 constituting a plastic board-shaped wafer holding feeder are brought into contact with the surface of the end plate member b1 mounted on an upper fixing member M and the upper fixing member M is vibrated for 24 Hz × several sec and the contact surface parts are melted by the friction heat generated at this time to be welded and bonded.
Inventors:
YODA YASUO
MATSUHASHI IZURU
UENO YOJI
ODA HITOSHI
MATSUHASHI IZURU
UENO YOJI
ODA HITOSHI
Application Number:
JP34856797A
Publication Date:
June 22, 1999
Filing Date:
December 03, 1997
Export Citation:
Assignee:
NICHIAS CORP
International Classes:
B65D85/86; B29C65/06; H01L21/673; H01L21/68; B29K61/00; B29K79/00; B29K81/00; (IPC1-7): B29C65/06; B65D85/86; H01L21/68
Attorney, Agent or Firm:
Takesaburo Nagata
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