Title:
PRODUCTION OF WIRING BOARD
Document Type and Number:
Japanese Patent JPH05299811
Kind Code:
A
Abstract:
PURPOSE: To produce a wiring board conveniently at low cost without requiring a troublesome pattern mask.
CONSTITUTION: A bonding member 2 is applied on an insulating board 1 and left in semi-cured state in first step, pads 3 are fused on the bonding member 2 at predetermined positions thereof in second step, predetermined pads 3 are connected through a wire 4 in third step, and the board 1 is hot pressed to cure the bonding member 2 completely thus bonding the pads 3 and the wire 4 to the board 1 in fourth step.
Inventors:
MASUDA MASAO
Application Number:
JP9842492A
Publication Date:
November 12, 1993
Filing Date:
April 20, 1992
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H05K3/10; H05K3/32; H05K3/20; H05K3/38; (IPC1-7): H05K3/10; H05K3/32
Attorney, Agent or Firm:
Teiichi