Title:
PROTECTIVE MEMBER FORMATION DEVICE
Document Type and Number:
Japanese Patent JP2017168616
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To make an adjustment such that the same amount of liquid resin can be applied to the center of a wafer every time.SOLUTION: A protective member formation device 1 comprises resin applying means 50 that applies an amount of liquid resin 8, which is required to adhere to the center of one face Wa of a wafer W held by holding means 60. The resin applying means 50 comprises: an applying part 51 that applies the liquid resin 8 to the wafer W; a supply box 53 that supplies the liquid rein 8 to the applying part 51; a first communication path 54a; a first check valve 55a; a second communication path 54b; and a second check valve 54b. Since a side wall 531 of the supply box 53 comprises an air tank 56 for accumulating air, the air tank 56 is expanded. By warping the internal wall face 531a of the side wall 531 toward the internal space of an accumulation part 530 and reducing the capacity of the internal space, an amount of liquid resin 8, required to be applied to the wafer W, can be supplied to the applying part 51. Accordingly, a small amount and the same amount of liquid resin 8 can be applied to the center of a wafer W every time.SELECTED DRAWING: Figure 1
Inventors:
KUBO TETSUO
KUWANA KAZUTAKA
KUWANA KAZUTAKA
Application Number:
JP2016052160A
Publication Date:
September 21, 2017
Filing Date:
March 16, 2016
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/683; B05C5/02; B05C11/02; B05C11/10; H01L21/304
Domestic Patent References:
| JP2013175647A | 2013-09-05 | |||
| JP2014114348A | 2014-06-26 |
Attorney, Agent or Firm:
Patent Business Corporation Tokyo Alpa Patent Office
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