To provide a protecting element applicable for reflow mounting and well responsive to current cut-off operation even when the liquid phase point or the solid phase point of a solder to be used has a higher temperature than a mounting temperature.

The protecting element has an elastic member 20 fixed via a solder 21 to a second conductor layer 15 and energizing electrode terminals 16, 17 formed on a predetermined substrate 11 to divide an energizing passage into a plurality of current cut-off parts. The liquid phase point of the solder 21 has a higher temperature than a mounting temperature when mounting the protecting element on protected equipment. The elastic member 20 is soldered to the second conductor layer 15 and the energizing electrode terminals 16, 17 in the state of holding such deformation stress as to leave the second conductor layer 15 and at least one of the energizing electrode terminals 16, 17 even when the solder 21 is not completely melted.