Title:
PROTECTING FILM-FORMING AGENT OF THERMAL HEAD BASE
Document Type and Number:
Japanese Patent JP3523276
Kind Code:
B2
Abstract:
PURPOSE: To obtain a protecting film-forming agent for thermal head base, having approximately the same coefficient of thermal expansion as that of thermal head base, not causing warpage, etc., not corroding an element on a base, comprising a polyether amide and an ether-based solvent.
CONSTITUTION: A protecting film-forming agent for thermal head base comprises (A) a polyether amide of formula I (X is bifunctional atom or functional group; Ar is aromatic hydrocarbon; Rn is alkyl) and (B) an ether-based solvent of formula II (l and n are 0 or 1 or >1 m is ≥2) (e.g. diethylene glycol dimethyl ether) alone or a mixture of the ether-based solvent and an ester-based solvent as essential components. Since the protecting film-forming agent contains the polyether amide resin whose coefficient of linear thermal expansion is close to that of the thermal head base, neither warpage nor undulation of base will occur during rise in temperature and since the solvent of the component B is neutral, the solvent will not corrode an electric part (aluminum, etc.) on a base.
Inventors:
Masatsu, Hideaki
Application Number:
JP11613292A
Publication Date:
April 26, 2004
Filing Date:
May 08, 1992
Export Citation:
Assignee:
ROHM CO LTD
International Classes:
B41J2/335; C09D177/00; C09D177/06; H01B3/42; (IPC1-7): C09D177/06; B41J2/335; H01B3/42
Attorney, Agent or Firm:
吉田 研二 （外１名）