PURPOSE: To form a surface acoustic element for surface mount with less propa gation loss without any concentrated surface wave to part of the electrode by applying a weather-proof resin material for the protection interdigital elec trode by the vapor deposition method.

CONSTITUTION: The input side interdigital electrode 2 made of aluminum and the output side interdigital electrode 3 are formed on a piezoelectric material substrate 1 by the photo etching method and the substrate is adhered to a ceramic substrate 4 by a resin adhesives 5. The bonding chip electrode 6 made of silver paradium, the input electrode 7 of the surface acoustic wave element and the output electrode 8 provided to the ceramic substrate 4 are subject to bonding by an aluminum wire 9 by means of the ultrasonic method. Then the resin film 10 with high weather-proof performance is coated thinly by the vapor-deposition or the plasma polymerization method in order to avoid the defect or change in the propagation speed caused by water content in air and dust adhered onto the surface acoustic wave propagation face and the interdigital electrodes 2, 3. Thus, the surface acoustic wave element for surface mount with less lossand small size is formed.