Title:
PROTECTION SHEET FOR SEMICONDUCTOR WAFER PROCESSING
Document Type and Number:
Japanese Patent JP2003249471
Kind Code:
A
Abstract:
To provide a protection sheet for semiconductor wafer processing which has basic performance as a semiconductor wafer processing protection sheet such as a back grind sheet and further has heat resistance which resists heating process, and also can restrain warp of a wafer in cooling after heating process.
In a protection sheet for semiconductor wafer processing wherein an adhesive layer is laminated on a base material sheet, a base material sheet has at least one layer of a porous base material sheet.
Inventors:
AKAZAWA MITSUHARU
MATSUMURA TAKESHI
KIUCHI KAZUYUKI
TAKAHASHI TOMOKAZU
KAWASHIMA TOSHIYUKI
TAWARA SHINJI
MATSUMURA TAKESHI
KIUCHI KAZUYUKI
TAKAHASHI TOMOKAZU
KAWASHIMA TOSHIYUKI
TAWARA SHINJI
Application Number:
JP2002045904A
Publication Date:
September 05, 2003
Filing Date:
February 22, 2002
Export Citation:
Assignee:
NITTO DENKO CORP
International Classes:
C09J7/02; C09J201/00; H01L21/301; H01L21/304; (IPC1-7): H01L21/304; C09J7/02; C09J201/00; H01L21/301
Attorney, Agent or Firm:
Takao Suzuki (3 others)