Title:
ウェハ加工用保護コーティング剤組成物、及びそれを含む保護コーティング剤
Document Type and Number:
Japanese Patent JP6862027
Kind Code:
B2
Abstract:
By forming a coating layer comprising hydroxylated polyurethane on the surface of a wafer, it is possible to prepare a protective coating agent for wafer processing according to the present invention that can fundamentally prevent damage occurring on the surface of the wafer in a processing step including cutting of the wafer during a semiconductor manufacturing process.
Inventors:
Park Sung Kyun
Eugene
Eugene
Application Number:
JP2020514592A
Publication Date:
April 21, 2021
Filing Date:
January 08, 2018
Export Citation:
Assignee:
MTI CO.,LTD.
International Classes:
C09D175/12; C11D1/14; C11D1/22; C11D1/29; C11D1/34; C11D1/62; C11D1/68; C11D1/72; C11D1/722; C11D3/37; C11D3/43; H01L21/301
Domestic Patent References:
| JP4323279A |
Foreign References:
| KR101764167B1 |
Attorney, Agent or Firm:
try international patent corporation