Title:
シリコーンレジン組成物およびシリコーンレジン組成物を用いた保護被覆工法
Document Type and Number:
Japanese Patent JP5726272
Kind Code:
B2
Abstract:
A silicone resin composition, which enables film formation at ordinary temperatures without heating, though using water as a solvent, to give a film having sufficient film properties, has been required. Disclosed is a silicone resin composition characterized by comprising a silicone resin or a moisture-curable silicone resin, a compound containing at least one element selected from among calcium, magnesium and aluminum, said compound serving as a curing catalyst for the resins, and water or moisture.
Inventors:
Hiroyuki Goka
Inoue Masao
Tomohiko Kanazawa
Yoshito Osawa
Furuyama Yoshito
Akinari Itagaki
Inoue Masao
Tomohiko Kanazawa
Yoshito Osawa
Furuyama Yoshito
Akinari Itagaki
Application Number:
JP2013232748A
Publication Date:
May 27, 2015
Filing Date:
November 11, 2013
Export Citation:
Assignee:
Japan Jicco Co., Ltd.
Nittetsu Sumikin Cement Co., Ltd.
Shin-Etsu Chemical Co., Ltd.
Nittetsu Sumikin Cement Co., Ltd.
Shin-Etsu Chemical Co., Ltd.
International Classes:
C08L83/04; C08K3/00; C09D5/02; C09D7/61; C09D183/04
Domestic Patent References:
| JP11050006A | ||||
| JP2001226636A | ||||
| JP2001011379A | ||||
| JP2001152090A | ||||
| JP2007238718A |
Foreign References:
| WO1998036016A1 |
Attorney, Agent or Firm:
Kenji Oka