Title:
保護フィルム及び導体箔積層体
Document Type and Number:
Japanese Patent JP4454805
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a protective film used to be applied to a conductor foil excellent in the protectivity of the conductor foil, not mixed with dust or the like, hard to generate wrinkles or a folding mark and having good handleability, and a conductor foil laminate using the same. SOLUTION: In the protective film used for being applied to the conductor foil constituted by partially forming an adhesive to one surface of a support, the adhesive layer 14 is formed to the peripheral edge part of a circuit forming scheduled region 12 for forming a circuit to the conductor foil. The circuit forming scheduled region 12 is preferably subjected to releasing treatment.
Inventors:
Miyako Tsuyoshi
Application Number:
JP2000201797A
Publication Date:
April 21, 2010
Filing Date:
July 04, 2000
Export Citation:
Assignee:
Fujimori Industry Co., Ltd.
International Classes:
B32B7/10; B32B7/14; B32B15/08; C09J7/02; C09J121/00; C09J133/00; C09J201/00; H01L23/12; H05K3/00
Domestic Patent References:
| JP81859A |
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Katsuichi Nishimoto
Hiroshi Fukuda
Kato Kazunori
Katsuichi Nishimoto
Hiroshi Fukuda