Title:
半導体用保護フィルム、半導体装置及び複合シート
Document Type and Number:
Japanese Patent JP6571398
Kind Code:
B2
Abstract:
[Solving Means] A semiconductor protective film 10 according to an embodiment of the present invention includes a protective layer 11 formed of a non-conductive inorganic material and an adhesive layer 12 provided on one surface of the protective layer 11. The protective layer 11 includes at least a vitreous material and is typically formed of plate glass. Accordingly, a warpage of a semiconductor element as a protection target can be suppressed effectively.
Inventors:
Naoya Okamoto
Ryohei Ikeda
Katsuhiko Horimei
Ryohei Ikeda
Katsuhiko Horimei
Application Number:
JP2015113907A
Publication Date:
September 04, 2019
Filing Date:
June 04, 2015
Export Citation:
Assignee:
LINTEC CORPORATION
International Classes:
B32B7/022; B32B9/00; B32B17/10; C09J7/20; C09J201/00; H01L21/60; H01L23/00; H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
| JP2002208571A | ||||
| JP10294423A | ||||
| JP2010199542A | ||||
| JP2001326195A | ||||
| JP2001135598A |
Foreign References:
| US20110062599 |
Attorney, Agent or Firm:
Junichi Omori
Mitsuru Takahashi
Ori Akira
Masayoshi Sekine
Teppei Nakamura
Ayako Kaneko
Nozomi Yoshida
Shintaro Kanayama
Chiba Ayako
Shiraka Tomohisa
Mitsuru Takahashi
Ori Akira
Masayoshi Sekine
Teppei Nakamura
Ayako Kaneko
Nozomi Yoshida
Shintaro Kanayama
Chiba Ayako
Shiraka Tomohisa