To obtain a protective film which endures the temperature (about 260C) in the reflow process and which, when attached, out of the top of the substrate in the reflow process, onto the electrode and circuit of the part having no bearing on the component mounting, even if solder balls or fluxes scatter on the electrode and circuit of the part, protects the part from becoming foul.
The protective film 1 consists of the heat-resistant resin layer 2 and the adhesive agent layer 3 formed on one surface of the heat-resistant resin layer 2. The heat-resistant resin layer 2 is an epoxy-modified nylon resin, a crosslinked polyurethane resin, a crosslinked acrylic resin or a blend of an epoxy resin and a polyamide resin. The adhesive agent layer 3 is a blend of an acrylic resin, an epoxy resin and an isocyanate resin, or a blend of an acrylic resin and an isocyanate resin.
IKOMA HIKARISHIRO
SHINOHARA HIROAKI
| JP2005053975A | 2005-03-03 | |||
| JP2005239884A | 2005-09-08 | |||
| JP2003165959A | 2003-06-10 | |||
| JP2004237517A | 2004-08-26 | |||
| JP2005332873A | 2005-12-02 | |||
| JP2005019518A | 2005-01-20 | |||
| JP2003261842A | 2003-09-19 | |||
| JP2000230159A | 2000-08-22 | |||
| JP2005053975A | 2005-03-03 | |||
| JP2005239884A | 2005-09-08 | |||
| JP2003165959A | 2003-06-10 | |||
| JP2004237517A | 2004-08-26 | |||
| JP2005332873A | 2005-12-02 | |||
| JP2005019518A | 2005-01-20 | |||
| JP2003261842A | 2003-09-19 |
| WO2005084948A1 | 2005-09-15 | |||
| WO2005084948A1 | 2005-09-15 |
Makoto Suhara