Title:
保護層形成用組成物、積層体およびキット
Document Type and Number:
Japanese Patent JP6831857
Kind Code:
B2
Abstract:
Provided are: a protective layer formation composition that has excellent characteristics for application on an organic semiconductor film and that does not damage the organic semiconductor film; and a laminate and a kit in which the protective layer formation composition is used. A protective layer formation composition for forming a protective layer for an organic semiconductor film, the protective layer formation composition containing a fluorine-based solvent and a resin A containing at least 9 mass% of oxygen atoms, wherein the concentration of the resin A dissolved in the protective layer formation composition for forming a protective layer for an organic semiconductor film is at least 1 mass%.
Inventors:
Mitsuru Sawano
Aoshima Toshie
Yu Iwai
Aoshima Toshie
Yu Iwai
Application Number:
JP2018563341A
Publication Date:
February 17, 2021
Filing Date:
January 16, 2018
Export Citation:
Assignee:
FUJIFILM Corporation
International Classes:
H05B33/04; C08K5/02; C08L1/10; C08L29/04; C08L65/00; H01L51/05; H01L51/30; H01L51/50
Domestic Patent References:
| JP2005513788A | ||||
| JP2010034342A | ||||
| JP2016164899A | ||||
| JP2015038976A |
Foreign References:
| WO2016125795A1 |
Attorney, Agent or Firm:
Patent Service Corporation Patent Office Sykes