保護部材形成装置 - Disco Co., Ltd.

Title:

保護部材形成装置

Document Type and Number:

Japanese Patent JP7339768

Kind Code:

B2

Abstract:

To efficiently form a protective member on a wafer.SOLUTION: After being moved at first speed V1 to a first position Z1 where an upper surface Ra of liquid resin R deposited on a sheet S and a lower surface Wb of a wafer W held on a holding surface 621a have a small gap, the lower surface Wb of the wafer W is moved at second speed V2 slower than the first speed V1 from the first position Z1 to a third position Z3 in which the upper surface Ra of the liquid resin R and the lower surface Wb of the wafer W come into contact with each other, and further, moved to a second position Z2 where a mounting surface 60a and the holding surface 621a have a predetermined interval. The liquid resin R spreads from a central section of the wafer W toward an outer periphery, and pressure that is applied on a liquid resin R and decreases with time is measured. When the pressure decreases up to a set value, the wafer W is separated from the holding surface 621a and a stage 60 and holding means 62 are separated from each other. Then, the liquid resin R is cured using curing means 65.SELECTED DRAWING: Figure 2

Inventors:

Kazutaka Kuwana
Hiroshi Onodera
Daichi Higuchi
Hiroshi Kurokawa

Application Number:

JP2019089697A

Publication Date:

September 06, 2023

Filing Date:

May 10, 2019

Export Citation:

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