To prevent overflow of an adhesive from an outer peripheral side of a wafer and adhesion of the adhesive to a device, when a protective tape adheres to a surface of the wafer to protect the device.
A protective member 3 in which a protective tape 1 having a ring-like adhesive layer arranged on only a part opposed to a periphery Wb of a wafer W, adheres to the wafer W, comprises a belt-like sheet 2 in which a weak adhesive layer having adhesive power being weaker than that of the ring-like adhesive layer, is arranged thereon, the belt-like sheet 2 having a larger area than that of the protective tape 1. The protective member is constituted by adhering a plurality of back surfaces of the protective tapes 1 to the weak adhesive layer of the belt-like sheet 2 at predetermined intervals in a longer direction. Since the belt-like sheet 2 has a larger area than that of the protective tape 1, it is easy to align the adhesive layer of the protective tape 1 with the periphery Wb of the wafer W by holding an edge of the sheet 2, and the overflow of the adhesive layer to the periphery side of the wafer W and the adhesion of an adhesive forming the adhesive layer to a device region Wa, can be prevented.
| JPS63176265A | 1988-07-20 | |||
| JP2005109433A | 2005-04-21 | |||
| JP2005123382A | 2005-05-12 | |||
| JP2013219096A | 2013-10-24 |
Isao Sasaki
Ken Kubo
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