Title:
PROTECTIVE STRUCTURE OF IC DATA CARRIER
Document Type and Number:
Japanese Patent JP2004240881
Kind Code:
A
Abstract:
To provide a protective structure of an IC data carrier capable of preventing the IC data carrier from being adversely affected by heat even if mounted on an article to be heated to high temperature.
In this protective structure of the IC data carrier, the IC data carrier 10 is protected with an inorganic heat resisting material. Examples of this protective structure includes a facing 12 of the IC data carrier 10, a case 3 for housing an IC carrier 2, a mounting part 31 of an article for mounting an IC carrier 5, and a mounting part 51 of an article for mounting a case 6 containing an IC carrier 5.
Inventors:
KOMINE TAKESHI
Application Number:
JP2003031435A
Publication Date:
August 26, 2004
Filing Date:
February 07, 2003
Export Citation:
Assignee:
DAISHOWA SEIKI
BIG ALPHA CO LTD
BIG ALPHA CO LTD
International Classes:
B42D15/10; G06K19/077; (IPC1-7): G06K19/077; B42D15/10
Attorney, Agent or Firm:
Yoshiyuki Inaba
Katsuro Tanaka
Shinji Oga
Katsuro Tanaka
Shinji Oga
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