Title:
緩衝材用パルプチップおよびその製造方法
Document Type and Number:
Japanese Patent JP7367331
Kind Code:
B2
Abstract:
To provide a buffer material suitable, for use in contact with food, which is continuously available, and to provide a method for producing the same.SOLUTION: A pulp chip for buffer material comprises dry pulp derived from wood crushed by a crusher and has a bulk density of 70 kg/m3 or more. In a crusher, it is preferable that the size of the hole passes through a screen mesh having a hole diameter set between 1 mm and 20 mm. The value obtained by dividing the tapping bulk density by the bulk density is preferably between 1.0 inclusive and 1.9 inclusive.SELECTED DRAWING: None
Inventors:
Kota Nakabachi
Yoshinori Kobayashi
Yoshinori Kobayashi
Application Number:
JP2019076565A
Publication Date:
October 24, 2023
Filing Date:
April 12, 2019
Export Citation:
Assignee:
Oji Holdings Co., Ltd.
International Classes:
B65D81/09; B02C18/00; B02C23/16; D21H11/00
Domestic Patent References:
JP5075169U | ||||
JP2000118571A | ||||
JP7016810A | ||||
JP2016055618A | ||||
JP58119885U | ||||
JP2001098078A | ||||
JP2000129600A | ||||
JP2001234500A | ||||
JP7017571A | ||||
JP2004262159A |
Foreign References:
WO2009142255A1 | ||||
WO2002002643A1 |
Attorney, Agent or Firm:
Yasushi Matsunuma
Yuichiro Kawagoe
Noriko Yanai
Shunsuke Fushimi
Tetsuya Kimizuka
Yuichiro Kawagoe
Noriko Yanai
Shunsuke Fushimi
Tetsuya Kimizuka
Previous Patent: Operation monitoring system for sieving equipment
Next Patent: Curable composition, cured product, and sealant
Next Patent: Curable composition, cured product, and sealant