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Title:
PULVERIZER AND METHOD OF PULVERIZING PRINTED CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2001000875
Kind Code:
A
Abstract:

To perform crushing and pulverization in a short time by providing a millstone in the shape of a bottomed vessel for housing crushed printed circuit boards and a mallet for striking the crushed printed circuit boards, forming the millstone and mallet into a conical concave side and a conical convex side respectively, and attacking material to be pulverized on both flanks by these conical concave side and conical convex side.

A pulverizer 200 for pulverizing printed circuit boards or the like to powder is provided with: a millstone 31 in the shape of a bottomed vessel for housing the crushed printed circuit boars; a mallet 33 for striking the crushed printed circuit boards; and a mallet driving cylinder 34 for reciprocating the mallet 33. At this time, the millstone 31 and the mallet 33 are formed into a conical concave side 31A and a conical convex side 33A respectively, and by the conical concave side 31A and the conical convex side 33A, material to be pulverized is attacked on both flanks. The millstone 31 attachably and detachably held on a holder 32 and the holder 32 form a continuous conical concave sides 31A, 32A. These conical concave sides 31A, 32A have an opening angle of 120° or less and the pulverized material falls by gravity on the conical concave sides 31A, 32A.


Inventors:
Hisakado, Takao
Kamimura, Takeshi
Shimizu, Kaoru
Terada, Nobuo
Furuya, Yoshiaki
Hirata, Akio
Application Number:
JP1999000172047
Publication Date:
January 09, 2001
Filing Date:
June 18, 1999
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
B09B5/00; B02C1/14; B02C13/22; B02C21/00; B09B5/00; B02C1/00; B02C13/00; B02C21/00; (IPC1-7): B02C1/14; B02C13/22; B02C21/00; B09B5/00



 
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