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Title:
PUMP AND PUMP SYSTEM
Document Type and Number:
Japanese Patent JP2007218163
Kind Code:
A
Abstract:

To provide a pump and a pump system capable of improving mounting efficiency to satisfy miniaturization demand of information apparatus and high density mounting demand of various types of electronic components and of being controlled without pulling out flexible tape or the like from the pump.

The pump 1 includes an impeller 11 having a plurality of blades 111 formed on an outer circumference and a rotor magnet 112 provided on an inner circumference, a plurality of projecting pole parts arrange with opposing to the rotor magnet 112 and radially extending toward a radial direction outward of the impeller 11, a pump casing 13 put between the rotor magnet 112 and a plurality of the projecting pole parts 121, a drive IC 16 supplying current to a coil wound around the plurality of projecting pole parts 121, and electronic substrate 15 having the drive IC 16 mounted thereon. The electronic substrate 15 is fixed on the pump casing 13 under a condition where the drive IC 16 is put between the plurality of projecting pole parts 121.

COPYRIGHT: (C)2007,JPO&INPIT


Inventors:
KURITA YUKINOBU
Application Number:
JP2006039252A
Publication Date:
August 30, 2007
Filing Date:
February 16, 2006
Export Citation:
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Assignee:
NIDEC SANKYO CORP
International Classes:
F04D5/00; F04D13/06; F04D29/00; H02K7/14; H02K11/00; H02K29/08; H02P6/16; H01M8/04
Domestic Patent References:
JP2004324551A2004-11-18
JPH0376974U1991-08-01
JPH11168858A1999-06-22
JP2003343492A2003-12-03
JPS6196778A1986-05-15
Attorney, Agent or Firm:
Patent business corporation cluster