To provide a pump unit and a molding apparatus which can be made compact and are cheap.
A pump unit 5 used in a molding apparatus 1 comprises: a frame 11; a storage tank 12 to store resin material; a pump 13 mounted at the frame 11 and equipped with a cylinder 24 and a piston 25; a three-way valve 16 connecting the storage tank 12 and the pump 13, or the pump 13 and its secondary side, and configured such that the above-mentioned connections can be switched; a temperature adjustment device 18 to adjust a temperature of resin material; and a drive mechanism 14 mounted at the frame 11 and equipped with a drive motor 31 having a rotating shaft 31a, a transmission mechanism 33 to convert rotation of the rotating shaft 31a of the drive motor 31 to motion in the straight line, and a coupling section 34 to couple the transmission mechanism 33 and the piston 25.
KAJITA ATSUSHI
SHIMO KAZUYUKI
NAMIKI YUKI
YAMANOI TOMOTAKA
SAKURAI HIROYUKI
| JP2005254539A | 2005-09-22 | |||
| JPS60189410A | 1985-09-26 | |||
| JPS61191148U | 1986-11-28 |
Yoshihiro Fukuhara
Makoto Nakamura
Nobuhisa Nogawa
Toshio Shirane
Takashi Mine
Kocho Chojiro
Naoki Kono
Katsu Sunagawa
Morisezo Iseki
Takao Ako
Tadashi Inoue
Tatsushi Sato
Takashi Okada
Mihoko Horiuchi
Takenori Masanori