To provide a punching die apparatus capable of preventing a thin band like material from miss feeding/a scratch flaw caused by the adhesion of the thin band like material and a die block upper face arising from sucking of a thin trip due to a negative pressure of a scrap discharge suction apparatus, etc., as well as a punching oil and stably manufacturing a excellent quality product and to provide a manufacturing method of an electronic part using the apparatus.

The apparatus comprizes an upper die 16 provided with a punch 12 relatively moving vertically a stripper 15 to guide the punch 12, and a lower die 21 provided with a die block 17 constituting a pair with the punch 12 and guide rails 22, 23 to guide running of the thin band like material 11 and a suction apparatus 29 to suck/discharge a scrap 26 punched from the thin band like material 11 into the die block 17 by the punch 12. By supplying air in between the die block 17 and the thin band like material 11, the suction/adhesion of the thin band like material 11 to the die block 17 is prevented.