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Patent Searching and Data


Title:
PUNCHING DIE, PUNCHING METHOD, PLATE MATERIAL FOR SHAPING PROCESS, AND MANUFACTURE OF PLATES
Document Type and Number:
Japanese Patent JP2001047400
Kind Code:
A
Abstract:

To provide a punching die for cutting a synthetic resin material of hard nature, a punching method for synthetic resin material of hard nature, and a plate material for molding a rotational symmetrical piece, and offer a method of manufacturing plates.

A punching die is structured so that cutters 11 and 12 in the form of oblong circle are fitted by pressure to an upper 3 and a lower base board 4 made of wood and arranged opposing as protruding 1-10 mm from the boards. When a synthetic resin plate 20 of hard nature is to be punched off, the maximum amount of sideways dislocation of the opposing tips of cutters 11 and 12 is made 0.02-0.3 mm while the drive-in depth of the tips is made 0.05-0.4 mm. A plate material for molding a rotational symmetrical piece made of synthetic resin of hard nature has a thickness of 0.2-6 mm and a shape of oblong circle and is formed using the above-mentioned die.


Inventors:
KASHIMOTO TAKAHISA
Application Number:
JP22617299A
Publication Date:
February 20, 2001
Filing Date:
August 10, 1999
Export Citation:
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Assignee:
TEEPI NETSUGAKU KK
TEIKOKU PISTON RING CO LTD
SHINEI SHOJI KK
International Classes:
B26F1/44; B26F1/00; (IPC1-7): B26F1/44; B26F1/00
Attorney, Agent or Firm:
Kenichi Okabe