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Patent Searching and Data


Title:
PUNCHING METHOD AND PUNCHING DEVICE
Document Type and Number:
Japanese Patent JP2009050901
Kind Code:
A
Abstract:

To provide a punching method capable of compatibly realizing the productivity and the working quality.

The punching method comprises a laser machining step of punching a prepared hole 2 at a predetermined part of a workpiece 1 by laser beam A irradiated from a laser head 12, and a press working step which is performed after the laser machining step and of forming a hole 3 having the hole area larger than that of the prepared hole 2 at the predetermined part by punching the workpiece 1 in a superposing manner on the prepared hole 2 by a punch 20 and a die 23 having the sectional area larger than the prepared hole 2. Since the buckling and the breakage of the punch 20 can be avoided, the hole 3 can be formed by the press-working excellent in the working accuracy and the surface property. Further, the laser machining and the press working with the very high productivity compared with the electric discharge process are combined with each other, and the punching can be efficiently performed with higher productivity than that of the electric discharge process. Thus, the excellent productivity and the working quality can be compatibly attained.


Inventors:
TAKESHITA KENGO
HOSHIYAMA TAKUJI
Application Number:
JP2007221124A
Publication Date:
March 12, 2009
Filing Date:
August 28, 2007
Export Citation:
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Assignee:
DENSO CORP
International Classes:
B21D28/24
Domestic Patent References:
JPH03165986A1991-07-17
JPH02224828A1990-09-06
JPH09216021A1997-08-19
JPH11129085A1999-05-18
JPH03165987A1991-07-17
JPH04365527A1992-12-17
Attorney, Agent or Firm:
Yoji Ito
Takahiro Miura
Fumihiro Mizuno