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Title:
PUNCHING METHOD AND ITS DEVICE, METHOD AND APPARATUS FOR CHANGING DIE CHIP IN DIE, AND DIE USED FOR PUNCHING METHOD
Document Type and Number:
Japanese Patent JP2002301522
Kind Code:
A
Abstract:

To prevent reprojection (surface defect) from occurring on a work, to contrive the discontinuance of deburring work and the improvement of mold life and to reduce the manufacturing cost of a die provided with a projecting part on its upper surface.

A clearance hole 35 for discharging punched refuse is provided on a die base 33 and a die-chip housing hole 37 which is larger than the clearance hole 35 is provided in a stepped shape in the upper part of the die base 33. A reversible chip 41 provided with a die hole 39 is provided detachably in the die-chip housing hole 37 and the projecting parts 43 are provided on both surface sides of the whole periphery of the edge of the die hole 39 of this die chip 41. The projecting part 43 on one side which is situated on the upper surface of the die chip 41 is used for a punching work and, when the life of this projecting part 43A on the one side is expired, the top of the die chip 41 is changed for the bottom and the punching work is performed by using the projecting part 43B on the other side. In the die chip 41, the shape of the die hole 39 can be made optionally for every size of various molds, so the punching work of various shapes is easily performed.


Inventors:
SHIMIZU MASAYUKI
HARA HIDEO
TAKAHASHI OSAMU
TAKAHASHI YOSHIAKI
Application Number:
JP2001103283A
Publication Date:
October 15, 2002
Filing Date:
April 02, 2001
Export Citation:
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Assignee:
AMADA ENG CT CO LTD
AMADA CO LTD
International Classes:
B21D28/24; B21D28/34; B21D37/04; (IPC1-7): B21D28/24; B21D28/34; B21D37/04
Domestic Patent References:
JP2001009538A2001-01-16
JP2001062527A2001-03-13
JP2000094059A2000-04-04
JP2001009544A2001-01-16
JPH0376621U1991-07-31
JPH08332529A1996-12-17
JPH0615842U1994-03-01
JP2000094064A2000-04-04
JP2000094065A2000-04-04
Attorney, Agent or Firm:
Hidekazu Miyoshi (8 outside)