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Patent Searching and Data


Title:
PUNCHING METHOD FOR PRINTED CIRCUIT BOARD AND DEVICE THEREFOR
Document Type and Number:
Japanese Patent JPH07266198
Kind Code:
A
Abstract:

PURPOSE: To perform an accurate punching with an inexpensive PCB punching device.

CONSTITUTION: A holding member 63 holding and traveling a substrate and a linear scale 62 both are installed on a working table 1. One side of identification marks prelabeled to a printed circuit board 4 is photographed by a camera means 2, finding the center position. Next, this printed circuit board 4 is traveled by hand so as to make the other side identification mark come in an image region, finding the center position as well. At this time, the position data of the holding means 63 are detected by the linear scale 62, and a distance between two centers of both these identification marks is found out on the basis of the center position data of these marks and the position data of the linear scale obtained by means of image processing. In addition, a distance between the desired holes being preset is compared with another distance between two mark centers found by operation, an error between both of them is uniformly assigned by half-and-half, determining each punching position, and thus punching is carried out by a punching means 3.


Inventors:
SAITO TSUTOMU
KATO SHINICHI
Application Number:
JP6305594A
Publication Date:
October 17, 1995
Filing Date:
March 31, 1994
Export Citation:
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Assignee:
SEIKOSHA KK
International Classes:
B26D5/30; B23B41/00; B23B49/00; B23Q17/24; B26D5/00; B26D5/06; B26D5/34; B26D7/01; B26F1/16; H05K3/00; H05K1/02; (IPC1-7): B23Q17/24; B23B41/00; B23B49/00; B26D5/30; B26F1/16; H05K3/00
Domestic Patent References:
JPH01115508A1989-05-08
JPH03277411A1991-12-09
Attorney, Agent or Firm:
Kazuko Matsuda