To reduce temperature variation of a semiconductor element located on a test site.
This pusher for a match plate in a test handler is provided with: a body part mounted to a mounting plate; and a pressing part projecting from the front surface of the body part, and pressing a semiconductor element mounted on an insert of a test tray. The pusher is structured such that an air through-hole guiding air at a predetermined temperature supplied from a duct to the back surface of the body part to the semiconductor element mounted on the insert of the test tray located on the front surface of the pressing part is penetratingly formed from the back surface of the body part to the front surface of the pressing part; and one or more air outlet holes letting out, to the upper side of a test site, a part of the air supplied from the duct through the air through-hole, by communicating with the air through-hole are bored on at least one-side surface of the pressing part.
JEON IN GU
KIM DONG HAN
JANG JAE WOO
JP2000171520A | 2000-06-23 | |||
JPH10206490A | 1998-08-07 |
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